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Mail Address: esempe@sub-paper.com
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IMPORTANT DATES
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- Submission Deadline 2024-12-07
- Registration Deadline 2024-12-14
- Conference Date 2024-12-21
- Notification Date About a week after the submission
ORGANIZING COMMITTEES
Conference Committee
Sarawut Ramjan,Thammas at University, Thailand
Martin Kampel, Vienna University of Technology, Austria
Prof. Grigoras Gheorghe, Gheorghe Asachi Technical University of Iasi, Romania
Prof. Muhammad Raza Ul Mustafa, Universiti Teknologi PETRONAS, Malaysia
Program Committee
Assoc. Prof. Ali Razban, Indiana University Purdue University, USA
Assoc. Prof. Md. Hasanuzzaman, University of Malaya, Malaysia
Assoc. Prof. Muhyiddine Jradi, University of Southern Denmark, Denmark
Prof. Adriano Péres, Federal University of Santa Catarina, Brazil
International Technical Committee
Prof. Dimitrios Karamanis,University of Patras, Greece
Prof. Songgang Qiu, West Virginia University, USA
Prof. Sandeep Saxena, Galgotias College of Engineering and Technology Greater Noida, india
Prof. Paul Wen, University of Southern Queensland, Australia
Prof. Jingshan Huang, The University of South Alabama (South), USA
Prof. Alireza Vali Pour Baboli, Technical and Vocational University, Iran
Prof. Michele Melchiori, University degli Studi di Brescia, Italy
Assoc. Prof. Naragain Phumchusri, Chulalongkorn University, Thailand
Assoc. Prof. GAJENDRA Sharma, Kathmandu University, Nepal
Assco. Prof. Thomas Lee, University of Illinois at Chicago, USA
Assoc. Prof. Fernanda Otilia Figueiredo, Faculdade de Economia, Universidade do Porto, Portugal
Dr. Dlzar Al Kez, Queen's University Belfast, UK
Dr. Musong Louis Katche, University of Buea, Cameroon
Dr. Asmae Berrada, International University of Rabat, Morocco
Dr. Mohammad Ebadollahi, K.N.Toosi University of Technology, Iran
Nurazean Maarop,Universiti Teknologi Malaysia, Malaysia
Yago Diez Donoso, Yamagata University, Japan
M. Ramya, Coimbatore Institute of Technology, India
Ford Lumban Gaol, Binus University, Indonesia